Frequency Agile Microwave Bonding System

akronüüm: FAMOBS
algus: 2008-11-01
lõpp: 2012-10-31
 
programm: FP7 - Euroopa Liidu 7. raamprogramm
alaprogramm: SME - Väikese ja keskmise suurusega ettevõtetele suuantud teadustegevused (VKEd)
instrument: BSG-SME-AG - Teadustöö VKE assotsiatsioonide huvides
projektikonkurss: FP7-SME-2007-2
projekti number: 218350
kestus kuudes: 48
partnerite arv: 15
 
lühikokkuvõte: The cost of packaging in microelectronics is around 30% of total production costs, but this is rising at an alarming rate due to the increasing consumer demand for smaller and smarter portable electronic devices. In micro-systems, the costs of packaging can be up to 80% of total production costs. Technological advances to reduce packaging costs are therefore of pivotal importance to maintain the competitive edge of assembly companies. Moreover, with the exodus of high volume packaging and assembly companies to low-wage countries such as China and India, the manufacturing industry in Europe needs to revitalise itself by encouraging design and innovation that will allow European companies to produce assembly equipment and materials of tomorrow that will feed into the Asian market. Our approach of using microwave technology in bonding has significant advantages over technologies made available in the market. In our approach we don’t need a closed microwave oven. Through the open design we can do the placement, alignment and curing at the same time. The use of this technology in reel-to-reel manufacturing will be possible. Due to the higher level of integration and signifcantly shorter cycle times this new technology will give European packaging companies a clear competitive advantage particularly over their US competitors. Quality of the bonds will be improved as well due to better selectivity and special designed materials as well as the precisely adaptable frequency of the microwave. It uses pulsed microwave sources and relies on the selection of a few resonant cavities frequencies that are jittered (mode hopping). The two characteristics permit not only the avoidance of electrical discharges through arcing, but also the accurate curing of the paste at the location of interest, i.e. at the interface between a die and the substrate for example in the case of DCA. The project is driven bei 6 SME-IAGs who want to create this clear competitive advantage for theirmembers.
partneri jrk nr ja roll partneri nimi riik kontaktisik koduleht
1 koordinaator FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V DE Walter Krause http://www.fraunhofer.de
2 partner CAMERA DI COMMERCIO, INDUSTRIA, ARTIGIANATO E AGRICOLTURA DI MILANO IT Attilio Martinetti http://www.mi.camcom.it
3 partner Mikrosystemtechnik Baden-Wuerttemberg e.V DE Peter Josef Jeuk http://www.mstbw.de
5 partner National Micoelectronics Institute UK Paul Jarvie http://www.nmi.org.uk
7 partner ACI ECOTEC GMBH & CO KG DE Herbert Seemann http://www.aci-ecotec.com
8 partner KEPAR ELECTRONICA SA ES Diego Romero http://www.kepar.es
10 partner Industrial Microwave Systems Ltd UK Christine Mckinnon http://www.industrial-microwave-systems.com
11 partner Ribler GmbH DE Derya Aras http://www.ribler-gmbh.de
12 partner HERIOT-WATT UNIVERSITY UK Eva Olszewska-Day http://www.hw.ac.uk
13 partner Eesti Innovatsiooni Instituut OÜ EE Lauri Nirgi
14 partner UNIVERSITY OF GREENWICH UK Alison Yakub http://www.gre.ac.uk
15 partner ASOCIATIA ROMANA PENTRU INDUSTRIA ELECTRONICA SI SOFTWARE RO Alexandru Borcea
16 partner SEHO SYSTEMS GMBH DE Uwe Adler http://www.seho.de
17 partner RF. COM LIMITED UK Ian Cains http://www.rfcom.co.uk
18 partner FRESHFIELD MICROWAVE SYSTEMS LIMITED UK Stuart Bonvini http://www.freshfieldmicrowave.com